AMIETE – ET (OLD SCHEME)

 

Code: AE25                 Subject: PHYSICAL ELECTRONICS AND SOLID STATE DEVICES

Flowchart: Alternate Process: DECEMBER 2009Time: 3 Hours                                                                                                     Max. Marks: 100

 

 

NOTE: There are 9 Questions in all.

·      Question 1 is compulsory and carries 20 marks. Answer to Q.1 must be written in the space provided for it in the answer book supplied and nowhere else.

·      Out of the remaining EIGHT Questions answer any FIVE Questions. Each question carries 16 marks.

·      Any required data not explicitly given, may be suitably assumed and stated.

 

 

Q.1       Choose the correct or the best alternative in the following:                                  (210)

       

a.       With the increase in the temperature of the intrinsic semiconductor

 

                   (A)  energy of the  atom increases       

                   (B)  holes are generated in the conduction band

(C)    resistance of the semiconductor increases                                                                 

(D)   atomic radius decreases.

       

b.      The Fermi-Dirac statistics is based on 

 

(A)    electron and photons                   

(B)  photons and protons

(C)  electrons and holes                      

(D)  gas molecules

            

             c.   The energy required to dislodge electrons from n type Si is

                  

(A)    0.05 eV                                      

(B)  0.5 eV

(C)  5.0 eV                                        

(D)  50.0 eV

 

             d.   The reverse saturation current ICO of Si diode varies as

 

(A)    T2                                               (B)  T3

(C)                                            (D) 

 

             e.   A Schottky diode has

                  

(A)     a large voltage drop than that of an ordinary diode      .

(B)     good ohmic resistance

(C)     a negligible storage time.

(D)    due to minority charge carriers.

 

             f.    In a MOSFET, the threshold voltage can be  lowered by

 

(A)     increasing the gate oxide thickness     

(B)     reducing  the substrate concentration

(C)     increasing  the substrate concentration

(D)  using the dielectric of lower constant  


             g.   The efficiency of an LED for generating light is directly proportional to the

 

(A)     temperature                                  (B) voltage applied

(C)  level of doping  used                     (D) current injected

 

             h.   The fill factor for the solar cells is approximately

 

(A)    0.2                                               (B)  0.1

(C)  0.7                                               (D)  1.0

 

             i.    The Hall coefficient for a  particular material was found to be zero. The material is

 

(A)    metal                                           (B)   intrinsic semiconductor

(C)  insulator                                       (D)  extrinsic semiconductor

 

             j.    Varactor diode has variable

 

(A)  Resistance                                    (B)  Capacitance

(C)  Inductance                                   (D)  None of above

 

 

Answer any FIVE Questions out of EIGHT Questions.

Each question carries 16 marks.

 

  Q.2     a.   How does the conductivity or resistivity of the semiconductor materials vary with temperature? Do metals also exhibit the same behaviour?           (8)

       

             b.   Differentiate between direct band gap and indirect band gap semiconductors with examples.                                                                      (8)

 

  Q.3     a.   A silicon semiconductor has the intrinsic carrier concentration of 1016 m–3 and donor density 1020 m–3. Extra carriers are produced in the semiconductor by the process of injection. If the extra carrier density at a point is equal to 1018 m–3, determine  the ratio of hole concentration to electron concentration at that point. Also estimate the percentage increase in p and n resulting from injection?                                   (8)

 

             b.   Explain Hall effect and discuss its application for semiconductor.                         (8)

 

  Q.4     a.   How rectifying contacts differ from ohmic contacts. Explain with examples.                         (8)

 

             b.   A Zener diode has ND = 1020 m–3 and NA  = 1023 m–3. Avalanche breakdown occurs in the diode when the electric field reaches 107 Vm–1. Calculate the breakdown voltage. Assume  to be 10–10 Fm–1.                                                           (8)

 

  Q.5     a.   Explain following terms for Bipolar transistors.                                                    (8)

 

                   (i)   Emitter injection                         (ii)  Current crowding

                   (iii) Kirk effect                                     (iv)  Base transport factor

       

             b.   Discuss briefly switching action in BJT. (8)


 

  Q.6     a.   Explain subthreshold operation of MOSFET and draw its characteristics.            (8)

       

             b.   Discuss briefly various short channel effect present in small geometry MOS devices            (8)

 

  Q.7     a.   What are the limiting conditions of a solar cell? Explain measures to improve the efficiencies of solar cells.                                                           (8)   

 

             b.   Explain the working of Gunn diode and write its applications.                             (8)

 

  Q.8     a.   Discuss with the help of figures, wafer preparation.  How it differs from crystal growth?                  (8)

 

             b.   Explain Hybrid circuits.  How these are different from monolithic circuits?            (8)

                                                                             

  Q.9           Write short notes (Any FOUR)                                                                     (44)

 

                                                                 (i)  Band to band tunneling (ii) Semiconductor Lasers

                                                                 (iii) CMOS Latch up      (iv) Photodetectors

                                                                 (v) Heterojunctions (vi) Charge transfer Device